Data Sheet Update: ProTek Devices’ U0402FCxxC, ULC0402FCxxC and ULLC0402FC05C

ProTek Devices has recently updated data sheets for its U0402FCxxC, ULC0402FCxxC and ULLC0402FC05C unbumped flip chip transient voltage suppressor (TVS) arrays.

u0402_picU0402FCxxC

The U0402FCxxC series of flip chips employ advanced silicon P/N junction technology. This provides unmatched board-level transient voltage protection against electrostatic discharge (ESD) and Electrical Fast Transients (EFT). Developed specifically for high-density circuit protection, this series meets IEC 61000-4-2 and 61000-4-4 requirements.

This series provides ESD protection greater than 25 kilovolts. This is with a peak pulse power dissipation of 250 Watts per line for an 8/20μs waveform. In addition, the U0402FCxxC series features superior clamping performance. It also boasts low leakage current characteristics and a response time of less than a nanosecond. Their low inductance virtually eliminates overshoot voltage due to package inductance. Ideal applications include cellular phones; MCM boards; wireless communication circuits; IR LEDs; and SMART and PCMCIA cards. Download the full data sheet here.

ULC0402FCxxC

The ULC0402FCxxC series of flip chips employ advanced silicon P/N junction technology. This provides unmatched board-level transient voltage protection against ESD and EFT. Developed specifically for high-density circuit protection, this series meets IEC 61000-4-2 and 61000-4-4 requirements.

This low capacitance series provides ESD protection greater than 25 kilovolts. This is with a peak pulse power dissipation of 200 Watts per line for an 8/20μs waveform. In addition, the ULC0402FCxxC series features superior clamping performance. It also boasts low leakage current characteristics and a response time of less than a nanosecond. Their low inductance virtually eliminates overshoot voltage due to package inductance. Ideal applications include smartphones, portable electronics, and PCMCIA and SMART cards. Download the full data sheet here.

ULLC0402FC05C

The ULLC0402FC05C flip chip also employs advanced silicon P/N junction technology. This provides unmatched board-level transient voltage protection against ESD and EFT. Developed specifically for high-density circuit protection, this series meets IEC 61000-4-2 and 61000-4-4 requirements.

This low capacitance device provides ESD protection greater than 25 kilovolts. This is with a peak pulse power dissipation of 200 Watts per line for an 8/20μs waveform. In addition, the ULLC0402FC05C features superior clamping performance. It also features low leakage current characteristics and a response time of less than a nanosecond. The low inductance virtually eliminates overshoot voltage due to package inductance. Ideal application include smartphones, portable electronics, and PCMCIA and SMART cards. Download the full data sheet here.

All the devices are RoHS and REACH compliant.

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