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EMI/ESD Filters for Cellular
Phones
Cellular phones, as with all
handheld and wireless devices are susceptible to the
damaging effects of ESD transients. To read more +Click
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article in PDF file format.
Ethernet
Protection - A Whole Solution
Using TVS devices in combination with other types of
protection technology to provide a whole protection
solution for Ethernet applications.
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ESD
- According to Standards or Real-World Conditions
What is ESD? How does it effect sensitive
IC components? Why the standards don't measure up to
real-world conditions? Find answers to these
questions and more.
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SPICE
Simulation: A Design Tool for Incorporating Low Capacitance
TVS Devices into High Frequency Applications
SPICE
modeling can be used to build a more-effective protection
network that provides both transient immunity and noise
filtering.
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ABD
vs MLVs - A Comparison Report between ABD Flip Chips and
MLVs
ProTek's
flip chip TVS devices use silicon P/N junction technology to
provide transient voltage protection against ESD, EFT and
tertiary lightning events. They are characterized by
their avalanche breakdown voltage, low clamping voltage and
low capacitance. Due to their avalanche
characteristics, they are also known, in the industry as
Avalanche Breakdown Diodes (ABD).
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TVS
Voltage Characteristics for an ESD Pulse
The most significant transient threat to IC components
connected directly to I/O ports is ESD. Typical
sources of ESD include Human Body Model (HBM), Machine Model
(MM) and Charge-Device Model (CDM).
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Understanding
Network Interface I/O Port Protection
With the increase in the number of network interface and
immunity standards, selecting a transient voltage
suppression (TVS) device for I/O port protection has become
a very confusing process for today's design engineer.
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Maximum
Peak Pulse Current (IPP) vs Pulse Duration (td)
for TVS Devices
Silicon Avalanche Junction Transient Voltage Suppressors
(TVS) are categorized according to their maximum peak pulse
power rating (PPP) for a specific pulse
waveshape.
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IEC
61000-4 Standard Transient Immunity Requirements
Electromagnetic Compatibility (EMC) has long been
accepted as a term to describe the control of
electromagnetic interference (EMI). Formerly, the
exclusive components of EMC were radiated and conducted
emissions.
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AJTVS
- The Forgotten Component in Circuit Design
In the past, electromagnetic compatibility (EMC)
requirements for electronic equipment were relatively
straightforward. Once a circuit design was completed,
the next step was to lay out a printed circuit board (PCB)
that provided the lowest level of radiated emissions for
networked systems.
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TVS
Device Selection, Location & Connection for EMC Design
Electromagnetic
Compatibility (EMC), one of many environments influencing
circuit design and board layout today, encompasses both
radiated emissions and transient immunity threats.
Basic protection from these threats can be achieved through
good engineering practices, such as shielding, grounding,
bonding and applying transient voltage suppression (TVS)
devices at key interface locations.
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Failure
Modes and Fusing of TVS Devices
Transient voltage
suppressors (TVS) will fail if they are subjected to
conditions beyond their designed limits. Therefore, it
is important to understand the types of failure modes
associated with TVS devices before designing them into a
circuit applications.
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"On-Chip"
Protection - A Self Defense
As a result of the
devastating effects of ESD and radiated emissions,
"On-Chip" protection structures have been an
integral part of the development and manufacturing process
of CMOS/NMOS IC Components.
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Power
Supply Voltage Transient Analysis & Protection
Any discussion on
transients should begin with a basic definition and
characterization. A voltage transient can be readily
defined as "an unexpected or unanticipated change in
voltage caused by an unpredictable and sometimes
unprecedented occurrence".
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