ProTek's patented* Flip Chip TVS Arrays are designed for small circuit board applications with limited size and space availability.  To reduce installation costs, the Flip Chip can be mounted directly onto the printed circuit board; similar to chip resistors and capacitors.  These devices are ideal for use in portable electronics such as Cellular Phones, Cellular Phone Accessories, Personal Digital Assistants (PDAs), Laptops and Pagers.

ProTek's Flip Chip TVS Arrays have been tested up to 25,000 volts of contact ESD conditions, and provide protection for both positive and negative transient events.  In addition, these devices meet ESD immunity requirement IEC 61000-4-2 (Air - 15kV, Contact - 8kV) and EFT immunity requirement IEC 61000-4-4 (40A, 5/50ns).

The standard series (P040xFCxxC and U040xFCxxC) of Flip Chips are rated for 250 Watts peak pulse power per line and the low capacitance series (ULLC0402FCxxC Series, LC040xFCxxC and ULC040xFCxxC) are rated for 200 Watts peak pulse power per line for an 8/20µs waveform.  In addition ProTek offers a packaged flip chip, the PKFC Series and the ultra low capacitance ULLC0402FCxxC Series.

All Flip Chips offered by ProTek are bidirectional.  They are available in bumped or unbumped die configurations with operating voltages ranging from 3.3V to 36V.

*Patent applies to standard series (P0402FCxxC, P0404FCxxC, P0406FCxxC and P0408FCxxC) only.  U.S. Patent No. Des. "D456,367 S"

To download a datasheet or quickly view the electrical characteristics of the product series, select the link in the drop down menu associated with the product series.